ISEP took part in Europe’s leading Forum for Electronic Components and Systems (EFECS 2025).
The event took place in Malta from the 3rd to the 5th of December and brought together industry leaders, policymakers, researchers, and innovators to strengthen Europe’s strategic leadership in semiconductor technology.
Three researchers – Luis Miguel Pinho, Luis Lino Ferreira and Ricardo Severino -represented the Software Technologies for Cyber-Physical Systems Laboratory (SoftCPS) at the forum, where they engaged with key stakeholders to explore new collaborative opportunities and potential project partnerships.
Their participation highlighted ISEP’s contribution to advancing research and innovation in cyber-physical systems, with ISEP/SoftCPS participating as a partner, in three projects funded under the Chips Joint Undertaking (Chips JU):
1) Arrowhead flexible Production Value Network (Arrowhead™ fPVN),
2) OPtimization of Electric Vehicle Autonomy (OPEVA), and
3) Model-Based Engineering of Digital Twins for early Verification and Validation of Industrial Systems (MATISSE).
These initiatives reinforce ISEP’s contribution to advancing research and innovation in cyber-physical systems, as well as the importance of strong collaboration between academia, industry, policymakers, and participating states in building long-term resilience and strategic autonomy across the European Union.